پاورپوینت کامل IMAPS Global Business Council Roadmap Process 61 اسلاید در PowerPoint

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پاورپوینت کامل IMAPS Global Business Council Roadmap Process 61 اسلاید در PowerPoint

اسلاید ۴: Market RequirementsTech RequirementsiNEMIITRSChip LevelSystem LevelITRS & iNEMI Packaging Roadmaps IntersectIMAPS addresses the Semiconductor Packaging needs of this space.

اسلاید ۵: What is the ITRSThe International Technology Roadmap for Semiconductors (ITRS) is an assessment of semiconductor technology requirements. The objective of the ITRS is to ensure advancements in the performance of integrated circuits. This assessment, called roadmapping, is a cooperative effort of global industry manufacturers and suppliers, government organizations, consortia, and universities. The ITRS identifies the technological challenges and needs facing the semiconductor industry over the next 15 years. It is sponsored by the European Semiconductor Industry Association (ESIA), the Japan Electronics and Information Technology Industries Association (JEITA), the Korean Semiconductor Industry Association (KSIA), the Semiconductor Industry Association (SIA), and Taiwan Semiconductor Industry Association (TSIA). SEMATECH is the global communication center for this activity. The ITRS team at SEMATECH also coordinates the USA region events. http://publ/

اسلاید ۶: ITRS Technology Working GroupsThe ITRS process encourages discussion and debate throughout the community about the requirements for success. The key factor in the success of the Roadmap is obtaining consensus on industry drivers, requirements, and technology timelines.The Technology Working Groups are the organizations that build the roadmaps. These representatives assess the state of technology and identify areas that may provide solutions. The TWG members also indicate opportunities for new research and innovation. These groups are made up of volunteer technology experts from chip manufactures, supplier companies, universities and academia, technology labs, and semiconductor technology consortia. The Technology Working Groups, also known as TWGs, are comprised of the technical disciplines of System DriversDesignTest and Test EquipmentProcess Integration, Devices, and StructuresRF and Analog/Mixed-signal Technologies for Wireless CommunicationsEmerging Research Devices and MaterialsFront End ProcessesLithographyInterconnectFactory IntegrationAssembly and Packaging – This is the area where IMAPS will focus.Environment, Safety, and HealthYield EnhancementMetrologyModeling and Simulation.

اسلاید ۷: Example of ITRS Short Term Challenges

اسلاید ۸: iNEMI has strong industry support.

اسلاید ۹: iNEMI Roadmap MethodologyiNEMI focusses on top level industry segments via their Product Emulator Groups.In addition, they address technology areas via their different Technology Working Groups.A “cross-cut” matrix ensures feedback between the various groups.

اسلاید ۱۰: iNEMI Technology Working Groups Business Processes/Technologies: Product Lifecycle Information Management Design Technologies: Environmentally Conscious ElectronicsModeling, Simulation & Design Tools Thermal Management Manufacturing Technologies:Board AssemblyTest, Inspection & Measurement Final Assembly Component Subsystem Technologies: Passive ComponentsRF Components & Subsystems Packaging – This is one of the areas where IMAPS will focus.Semiconductor TechnologyOrganic Substrates Mass Data StorageConnectorsEnergy Storage SystemsOptoelectronicsSensorsOrganic and Printed ElectronicsCeramic Substrates – IMAPS also contributes to this TWG.

اسلاید ۱۱: iNEMI Cross-cut MatrixA “cross-cut” matrix ensures feedback between the various groups.

اسلاید ۱۲: Example of iNEMI short term challenges

اسلاید ۱۳: Update calendar for ITRS / iNEMI2006 ITRS Roadmap release scheduled for December 4, 2006.2007 iNEMI Roadmap release scheduled for February 2007 at APEX, Los Angeles.

اسلاید ۱۴: Why IMAPS should be involved.ITRS focuses mainly on “front end” wafer fab areas, with a chapter on Semiconductor Assembly & Packaging.iNEMI focuses mainly on “board level” assembly, with a chapter on Semiconductor Assembly & Packaging.ITRS/iNEMI are working together to align their Semiconductor Assembly & Packaging Roadmaps.Many of the same people are on both teams.Some IMAPS members are also on both teams.IMAPS’ focus is on Semiconductor Assembly & Packaging.It’s a natural fit to take the output of the ITRS/iNEMI Semiconductor Assembly & Packaging Roadmaps and use that output to direct IMAPS’ activities towards solving gaps in the roadmap.IMAPS’ corporate members will benefit by developing real industry solutions for real industry challenges.

اسلاید ۱۵: Global Semiconductor Packaging Materials OutlookSource: SEMI Industry Research and Statistics and TechSearch International, November 2005This forecast was supplied courtesy of SEMI & Techsearch International. The full report is available from SEMI’s web catalog at w .Market Size for Materials = Market Opportunities for IMAPS members.

اسلاید ۱۶: Launched “The Road Ahead” in Advancing Microelectronics 4/06

اسلاید ۱۷: Roll-out plan for IMAPS to address roadmapsForm a GBC Roadmap Team.- DONEGBC Roadmap Team creates a roadmap template (“red brick”) and identifies current gaps on the existing roadmaps. – DONEGBC Roadmap Team communicates those gaps to the NTC.GBC and NTC structure future IMAPS events to focus on those gaps – ongoing.Dave Saums to give short presentation at LED & Thermal ATWs in September 2006.Meantime, GBC/NTC to support ITRS/iNEMI updates with input & communicate back to IMAPS issues/trends.Use IMAPS members on the ITRS/iNEMI roadmap TWGs to facilitate communication: Laurie Roth, Howard Imhof….and other volunteers.Red Brick templateRed Brick templateRed Brick templateRed Brick templateRed Brick template 200620072008etc X Manufacturing solutions exist and are being optimized.Manufacturing solutions exist and are being optimized.Manufacturing solutions exist and are being optimized.Manufacturing solu